William Lee to James Madison, 29 April 1806 (Abstract)

From William Lee, 29 April 1806 (Abstract)

§ From William Lee. 29 April 1806, Bordeaux. “I have the honor to transmit you enclosed a letter I have just recd. from Mr Skipwith announcing his arrival.1

RC (DNA: RG 59, CD, Bordeaux, vol. 2). 1 p.

1. Enclosure not found. For Fulwar Skipwith’s arrival at Paris, see John Armstrong to JM, 26 Apr. 1806.

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Source Project: Madison Papers
Title: William Lee to James Madison, 29 April 1806 (Abstract)
Author: Lee, William
Recipient: Madison, James
Date: 29 April 1806

Reference

Cite as: “William Lee to James Madison, 29 April 1806 (Abstract),” Founders Online, National Archives, https://founders.archives.gov/documents/Madison/02-11-02-0479. [Original source: The Papers of James Madison, Secretary of State Series, vol. 11, 1 January 1806–31 May 1806, ed. Mary A. Hackett, J. C. A. Stagg, Mary Parke Johnson, Anne Mandeville Colony, and Katherine E. Harbury. Charlottesville: University of Virginia Press, 2017, p. 524.]

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