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No. | Author | Recipient | Title | Date | Context |
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1 | Meigs, Josiah | Madison, James | To James Madison from Josiah Meigs, 3 April 1814 | 1814-04-03 | The Subscriber has the honour, respectfully to represent to the President of the United States,... |
2 | Meigs, Josiah | Madison, James | To James Madison from Josiah Meigs, 1 December 1814 | 1814-12-01 | The Commissioner of the General Land Office respectfully represents to the President of the U... |
3 | Meigs, Josiah | Madison, James | To James Madison from Josiah Meigs, 12 December 1814 | 1814-12-12 | I have the honor to enclose herein, for your approbation, leases of two lead mines in the... |
4 | Meigs, Josiah | Madison, James | To James Madison from Josiah Meigs, 25 February 1815 | 1815-02-25 | The letters from the Land officers at Canton, which you did me the honor to refer to me, I duly... |
5 | Meigs, Josiah | Madison, James | To James Madison from Josiah Meigs, 6 March 1815 | 1815-03-06 | The act of Congress of 6th May 1812, entitled “an Act to provide for designating, surveying and... |
6 | Meigs, Josiah | Madison, James | To James Madison from Josiah Meigs, [ca. 17 March 1815] | 1815-03-17 | I have the honor to transmit herewith a number of letters recommending persons who are desirous... |
7 | Meigs, Josiah | Madison, James | To James Madison from Josiah Meigs, 28 March 1815 | 1815-03-28 | Annexed I have the honor to communicate an extract of a letter dated 11th. inst. from Thomas Sloo... |
8 | Meigs, Josiah | Madison, James | To James Madison from Josiah Meigs, 27 April 1815 | 1815-04-27 | I have the honor to enclose a letter from Mr Kerr, relative to the road from the foot of the... |
9 | Meigs, Josiah | Madison, James | To James Madison from Josiah Meigs, 27 April 1815 | 1815-04-27 | I have the honor to enclose a letter from the Register of the Land office at St. Stephens, from... |
10 | Meigs, Josiah | Madison, James | To James Madison from Josiah Meigs, 6 May 1815 … | 1815-05-06 | § From Josiah Meigs. 6 May 1815, General Land Office. “The original of the enclosed patent was... |