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    • Lee, William
  • Recipient

    • Madison, James

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Documents filtered by: Author="Lee, William" AND Recipient="Madison, James"
Results 91-100 of 158 sorted by date (descending)
§ From William Lee. 14 September 1805, Bordeaux . “I have the honor to enclose you a bill of...
§ From William Lee. 8 September 1805, Bordeaux . “Should Mr Hammond of New York, or Capt. marner,...
§ From William Lee. 4 August 1805, Bordeaux. “I take the liberty to enclose you a copy of my...
§ From William Lee. 25 July 1805, Bordeaux. “Mr. John Erving of Boston, is desirous of being...
§ From William Lee. 21 July 1805, Bordeaux. No. 241. “I have the honor to transmit you enclosed a...
§ From William Lee. 20 July 1805, Bordeaux. “I have the honor herewith to transmit you a return...
§ From William Lee. 16 July 1805, Bordeaux. “I have the honor to enclose you a duplicate copy of...
18 June 1805, Bordeaux . “I take the liberty to enclose you a copy of a letter I wrote the...
19 May 1805, Bordeaux . “I beg leave to transmit you a copy of my correspondence relating to the...
18 May 1805, Bordeaux . “In my letters to yourself and the Secretary of the Treasury under date...