To James Madison from Richard Bland Lee and Tench Ringgold, 15 February 1816

From Richard Bland Lee and Tench Ringgold

Office of the Commissioners of the Public Buildings
Feb. 15. 1816

Sir,

Inclosed we forward a contract made with the Bank of Washington for an additional loan for thirty seven thousand five hundred dollars,1 part of the loan authorised by the act of Congress for repairing or rebuilding the public buildings in the city of Washington for your approbation—and have the honor to subscribe ourselves with great consideration yr most obt svts

Richard Bland Lee
Tench Ringgold

RC (DLC).

1. Enclosure not found.

Index Entries

You Are Looking At

Source Project: Madison Papers
Title: To James Madison from Richard Bland Lee and Tench Ringgold, 15 February 1816
Authors: Lee, Richard Bland
Ringgold, Tench
Recipient: Madison, James
Date: 15 February 1816

Reference

Cite as: “To James Madison from Richard Bland Lee and Tench Ringgold, 15 February 1816,” Founders Online, National Archives, https://founders.archives.gov/documents/Madison/03-10-02-0246. [Original source: The Papers of James Madison, Presidential Series, vol. 10, 13 October 1815–30 April 1816, ed. Angela Kreider, J. C. A. Stagg, Mary Parke Johnson, Katharine E. Harbury, and Anne Mandeville Colony. Charlottesville: University of Virginia Press, 2019, p. 230.]